Reflow oven - Company Ranking(19 companies in total)
Last Updated： Aggregation Period:Oct 07, 2026〜Nov 03, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Specifications】 ■ Number of chambers: 1 chamber (heating & cooling) ■ Device size: Approximately W1000 x D750 x H1300, about 450kg ■ Proces... | 【Applications】 ■ Power modules and other devices ■ Wafer bumps (bump formation) ■ LED ■ FCB *For more details, please refer to the related ... | ||
| 【Other Features】 ■ Safe supply and discharge of formic acid - Equipped with our proprietary formic acid decomposition treatment unit - Compl... | For more details, please download the PDF or feel free to contact us. | ||
| 【Specifications】 ■ Number of chambers: 1 to 4 chambers (heating & cooling) ■ Device size: Approximately W4300 x D1350 x H1850 (MPX3) ■ Proce... | 【Applications】 ■ Power modules and other devices ■ Wafer bump (bump formation) ■ LED ■ FCB *For more details, please refer to the related l... | ||
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オリジン
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- Featured Products
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Formic Acid Reduction Vacuum Reflow Furnace / Batch Type 'Model: SQ1'
- overview
- 【Specifications】 ■ Number of chambers: 1 chamber (heating & cooling) ■ Device size: Approximately W1000 x D750 x H1300, about 450kg ■ Proces...
- Application/Performance example
- 【Applications】 ■ Power modules and other devices ■ Wafer bumps (bump formation) ■ LED ■ FCB *For more details, please refer to the related ...
Formic acid reduction vacuum reflow furnace
- overview
- 【Other Features】 ■ Safe supply and discharge of formic acid - Equipped with our proprietary formic acid decomposition treatment unit - Compl...
- Application/Performance example
- For more details, please download the PDF or feel free to contact us.
Formic Acid Reduction Vacuum Reflow Furnace / Multi-Module Type 'MPX Series'
- overview
- 【Specifications】 ■ Number of chambers: 1 to 4 chambers (heating & cooling) ■ Device size: Approximately W4300 x D1350 x H1850 (MPX3) ■ Proce...
- Application/Performance example
- 【Applications】 ■ Power modules and other devices ■ Wafer bump (bump formation) ■ LED ■ FCB *For more details, please refer to the related l...
-
オリジン
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